Bangalore, Feb 23 (UNI) Hindustan Semiconductor Manufacturing inc (HSMC) will, in three weeks time, sign up with a multinational partner to start work on a Semiconductor Fab in India with an initial investment of one billion dollars.
HSMC Managing Partner Devendra Verma told UNI that he was in negotiation with the Governments of Karnataka, Tamil Nadu and Andhra Pradesh for locating the Fab and also various downstream units.
Initially the Fab would have the capacity to churn out 300,000 wafers annually with a revenue yield of around 300 to 350 million dollars. It would be producing chips in 130 nm (nanometre) and 90 nm grades. Subsequently the company would also have a second foundary that could take up production of 65 nm chips with an additional investment of around Two billion dollars.
He said that the company would be concentrating on producing chips for mobile telephones, smart cards, SIM cards and automotives.
UNI
HSMC Managing Partner Devendra Verma told UNI that he was in negotiation with the Governments of Karnataka, Tamil Nadu and Andhra Pradesh for locating the Fab and also various downstream units.
Initially the Fab would have the capacity to churn out 300,000 wafers annually with a revenue yield of around 300 to 350 million dollars. It would be producing chips in 130 nm (nanometre) and 90 nm grades. Subsequently the company would also have a second foundary that could take up production of 65 nm chips with an additional investment of around Two billion dollars.
He said that the company would be concentrating on producing chips for mobile telephones, smart cards, SIM cards and automotives.
UNI
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